TT300A-WB

This transfer robot developed for EFEM boosts cost performance and realizes high performance.
This high-speed, ultra clean robot are the flagship model in tazmo line.

見取図.PDF 見取図.DXF


Features

  • Promoting standardization of parts and modules enables low cost product.
  • Compared to the conventinal model, downsizing 15% od the robot footprint and 50% of the controller volume have succeeded.
  • For SEMI F47.
  • Guaranteed for three years by high reliability design.
  • Mapping sensor availables as an optin.

Specifications

Handling object

φ100mm to φ300mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

Range of motion R:250㎜(maximum arm reach,excluding end-effector)
T:370°(±185° from Home pos)
Z:330㎜
Repeatability

R:±0.1mm or less(3σ)

T:±0.02deg or less(3σ)
Z:±0.05mm or less(3σ)

Wafer holding method Selectable from options
Wafer hold check Vacuum sensor with digital display
Communication RS232C,ETHERNET
Utility

Power:1φ AC200V~230V 5A 1line

Vacuum:-80 kPa or less 15L/min or less 1line

(φ6 × φ4 polyurethane tube one-touch fitting connected)

Mass

Main body:Appox.34kg

Controller(MCQ):Appox.10kg

Contact us for questions about products.

product contact_1

  • contact smartphone notice
  • contact smartphone tel
  • contact smartphone fax
  • contact smartphone mail