TA300A-VAA
This aligner enables to detect a wafer position by using a built-in sensor and to align a notch or orientation flat.
For centering of VA type, the additional mechanism(Robot etc) to execute a motion correction based on the data output from an aligner will be required.
Features
- Originally developed lader sensor enables to detect it regaedless of materials of wafer.
- The wafer size of 150mm to 300mm are automatically discriminated.
- Compact design realized a built-in controller.
- Guaranteed for three(3) years by high reliability design.
Specifications
Handling object |
φ150mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) |
Alignment time |
2.5seconds or less (When Processing φ300mm) |
Alignment accuracy |
θ:±0.1° or less(3σ) |
Wafer off-center limit |
±1mm or less (Wafer offset from chuck center) |
Wafer holding method | Backside vacuum chuck |
Wafer hold check | Pressure sensor |
Communication |
RS-232C(Serial Interface) |
Utility |
Power:DC24V±10% 5A 1line Vacuum:φ6mm -80kPa or less.1line |
Mass | Main body:Appox.4kg |