MTQ-E
This transfer robot handles wafer sizes up to 300mm.
This high-speed, ultra clean robot are the flagship model in tazmo line.
Features
- Accesses three FOUPs without trackes.
- Changer mechanism for sharply reduced wafer swap-out times.
- Mapping sensor availables as an optin.
- The modular design of the R・T unit and elevation unit enables easy maintenanse, and also supports a long vertical stroke.
- Prepared a new line up for 450mm wafer transfer with improved arm rigidity.
Specifications
| Handling object |
φ100mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) |
|---|---|
| Range of motion |
R：590㎜(maximum arm reach,excluding end-effector) W：350°(±180° from Home pos) P:180deg |
| Repeatability |
XY：±0.1mm or less（3σ) P:0.02deg or less（3σ) |
| Wafer holding method | Selectable from options |
| Wafer hold check | Vacuum sensor with digital display |
| Communication | RS232C,RS0485 |
| Utility |
Power：1φ AC100V 7.5A 1line :1φ AC208V 5.0A 1line Vacuum：-80 kPa or less 1line (φ6 × φ4 polyurethane tube one-touch fitting connected) |
| Mass |
Main body:Appox.50kg Controller(MCQ)：Appox.18kg |
Contact us for questions about products.
