MPL-BE2-1
Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.
Features
- Compliant with 10^-1Pa vacuum environments by adapting servo motor on all axes and unique structure.
- Contact us for materials of end effector and wafer contact portion.
- Configurable with no vertical axis(Z) specifications(Contact us for details)
Specifications
Handling object |
φ100mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) 6inch MASK |
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Range of motion | R:330㎜(maximum arm reach,excluding end-effector) T:370°(±185° from Home pos) Z:380㎜ |
Repeatability | XY:±0.1mm or less(3σ) Z:±0.05㎜ |
Handling system | Recess(Pocket) |
Handling hold check | N/A |
Vacuum isolation level | 10^-1Pa |
Communication | RS-232C,RS-485(Serial Interface) |
Utility | 1φ AC100V 7.5A 1line |
Mass |
Main body:Appox.71kg Controller(MCQ):Appox.16kg |