TT300A-RA
This transfer robot developed for EFEM boosts cost performance and realizes high performance.
This high-speed, ultra clean robot are the flagship model in tazmo line.
Features
- Promoting standardization of parts and modules enables low cost product.
- By our original high-speed exchange mechanism, it enables wafer exchange with a half of the original time.
- New control system realizes high-speed and smooth opreation.
- Compared to the conventinal model, downsizing 15% od the robot footprint and 50% of the controller volume have succeeded.
- For SEMI F47.
- Guaranteed for three years by high reliability design.
- Mapping sensor availables as an optin.
- Accesses two FOUPs without trackes.
Specifications
| Handling object |
φ100mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) |
|---|---|
| Range of motion | R：430㎜(maximum arm reach,excluding end-effector) T：370°(±185° from Home pos) Z：330㎜ |
| Repeatability | XY：±0.1mm or less（3σ) Z：±0.05mm or less（3σ) |
| Wafer holding method | Selectable from options |
| Wafer hold check | Vacuum sensor with digital display |
| Communication | RS232C,ETHERNET |
| Utility |
Power：1φ AC200V～230V 5A 1line Vacuum：-80 kPa or less 15L/min or less 1line (φ6 × φ4 polyurethane tube one-touch fitting connected) |
| Mass |
Main body:Appox.35kg Controller(MCQ)：Appox.10kg |
Contact us for questions about products.
