Features
- Accesses two FOUPs without trackes.
- Mapping sensor availables as an optin.
- The modular design of the R・T unit and elevation unit enables easy maintenanse, and also supports a long vertical stroke.
- Prepared a new line up for 450mm wafer transfer with improved arm rigidity.
Specifications
| Handling object |
φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) |
|---|---|
| Range of motion |
R：430㎜(maximum arm reach,excluding end-effector) W：350°(±180° from Home pos) P:180deg |
| Repeatability |
XY：±0.1mm or less（3σ) P:0.05deg or less（3σ) |
| Wafer holding method | Selectable from options |
| Wafer hold check | Vacuum sensor with digital display |
| Communication | RS232C,RS-485 |
| Utility |
Power：1φ AC200V~AC230V 5.0A 1line Dryair：0.5MPa 150L/min or more 1line (φ6 × φ4 polyurethane tube one-touch fitting connected) |
| Mass |
Main body:Appox.60kg Controller(MCQ)：Appox.18kg |
Contact us for questions about products.
