MPL-ZN2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

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Features

  • Compliant with 10^-1Pa vacuum environments by adapting servo motor on all axes and unique structure.
  • Contact us for materials of end effector and wafer contact portion.

Specifications

Handling object

φ100mm to φ300mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

6inch MASK

Range of motion R:480㎜(maximum arm reach,excluding end-effector)
T:370°(±185° from Home pos)
Repeatability R:±0.1mm or less(3σ)
Handling system Recess(Pocket)
Handling hold check N/A
Vacuum isolation level 10^-1Pa
Communication RS-232C(Serial Interface)
Utility

Driver power:DC24V±5% 10A

Control power:DC24V±5% 3.15A 

Mass

Main body:Appox.25kg

Controller(MCQ):Appox.5kg

Contact us for questions about products.

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