MPL-CE3-2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

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Features

  • Compliant with 10^-1Pa vacuum environments by adapting servo motor on all axes and unique structure.
  • Contact us for materials of end effector and wafer contact portion.
  • Configurable with no vertical axis(Z) specifications(Contact us for details)
  • Branching arm structure minimizes the turning radius of double hands with maximum reach.

Specifications

Handling object

φ100mm to φ300mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

6inch MASK

Range of motion R:430㎜(maximum arm reach,excluding end-effector)
T:370°(±185° from Home pos)
Z:380㎜
Repeatability XY:±0.1mm or less(3σ)
Z:±0.05㎜
Handling system Recess(Pocket)
Handling hold check N/A
Vacuum isolation level 10^-1Pa
Communication RS-232C,RS-485(Serial Interface)
Utility 1φ AC200V~AC230V±10% 7.5A 1line
Mass

Main body:Appox.64kg

Controller(MCQ):Appox.16kg

Contact us for questions about products.

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