MPL-DA3-2

Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.

見取図.PDF 見取図.DXF


Features

  • Compliant with 10^-1Pa vacuum environments by adapting servo motor on all axes and unique structure.
  • Contact us for materials of end effector and wafer contact portion.
  • Configurable with no vertical axis(Z) specifications(Contact us for details)

Specifications

Handling object

φ100mm to φ300mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

6inch MASK

Range of motion R:590㎜(maximum arm reach,excluding end-effector)
T:370°(±185° from Home pos)
Z:200㎜
Repeatability XY:±0.1mm or less(3σ)
Z:±0.05㎜
Handling system Recess(Pocket)
Handling hold check N/A
Vacuum isolation level 10^-1Pa
Communication RS-232C,RS-485(Serial Interface)
Utility 1φ AC200V~230V 7.5A 1line
Mass

Main body:Appox.76kg

Controller(MCQ):Appox.16kg

Contact us for questions about products.

product contact_1

  • contact smartphone notice
  • contact smartphone tel
  • contact smartphone fax
  • contact smartphone mail