MAF-QI

This product is designed for thin wafer Notch/Flat aligning also centering at high speed by using Bernoulli effect.

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Features

  • Thin wafer or warpsd wafer can be aligned by Bernoulli effect.
  • Contact type is capable to handle as thin as 50μm thick wafers.

Specifications

Handling object

φ150mm to φ200mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

Alignment time

5.5seconds or less

(When Processing φ100mm)

Alignment accuracy

XY:±0.1mm or less(3σ)

θ:±0.1° or less(3σ)

Wafer off-center limit

±10mm or less

(Wafer offset from chuck center)

Wafer holding method Wafer Backside minimum partial contact
Wafer hold check Reflective origin sensor
Communication

RS-232C(Serial Interface)

Photo I/O(Parallel interface)

Utility

Power:DC24V±10% 5A 1line

Dry air1:φ6mm 0.05 to 0.35MPa 100L/min,1line

Dry air2:φ4mm 0.2 to 0.3MPa 100L/min,1line

Mass Main body:Appox.14kg

Contact us for questions about products.

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