MAF-MJ

This 200mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

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Features

  • Configurable for compound semiconductor wafers and glass wafers.(Please inquire us for details)
  • Clean alignment enabled by limiting contact to the wafer edge.
  • Notch/Flat are automatically recognized, eliminating the need for host controller settings.
  • Buil-in controller for a compact design.

Specifications

Handling object

φ200mm SEMI/JEIDA standard wafer.

Alignment time

8.0seconds or less

(20.0seconds of less when separate chucking required)

Alignment accuracy

θ:±0.2° or less(3σ)

Wafer off-center limit

±2mm or less

(Wafer offset from chuck center)

Wafer holding method Edge hold
Wafer hold check Photo micro sensor
Communication

RS-232C(Serial Interface)

Utility

Power:DC24V±10% 5A 1line

Dry air:φ6mm 0.12MPa to 0.2MPa 1line

Mass Main body:Appox.8kg

Contact us for questions about products.

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