MAF-HJ

This 200mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer.

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Features

  • Clean alignment enabled by limiting contact to the wafer edge.
  • Notch/Flat are automatically recognized, eliminating the need for host controller settings.
  • Buil-in controller for a compact design.

Specifications

Handling object

φ200mm SEMI/JEIDA standard wafer.

Alignment time

9.0seconds or less

(23.0seconds of less when separate chucking required)

Alignment accuracy

θ:±0.2° or less(3σ)

Wafer off-center limit

±1mm or less

(Wafer offset from chuck center)

Wafer holding method Edge hold
Wafer hold check Photo micro sensor
Communication

RS-232C(Serial Interface)

Utility

Power:DC24V±10% 3A 1line

Dry air:φ6mm 0.35MPa to 0.4MPa 1line

Mass Main body:Appox.8kg

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