MAF-GA

This eage contact free unit aligns and centers both flat and notch type wafers at high speeds.

見取図.PDF 見取図.DXF


Features

  • High speeds enabled by the units ability to center wafers and perform angle alignment without seperate chucking.
  • Compatible with multiple wafers:200-300mm SEMI/JEIDA silicon wafers.
  • Wafer size and nocth/flat are automatically recongnize,eliminating the need for host controller settings.
  • Built-in controller for a compact design.
  • Controllable through RS-232C or RS-485 serial interface or through photo I/O parallel communications.
  • Configurable for compound semiconductor wafers and transparent glass wafers by utilizing CCD photo receiver for line sensor.

Specifications

Handling object

φ200mm to φ300mm SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

Alignment time

4.5seconds or less

(When Processing φ300mm)

Alignment accuracy

XY:±0.1mm or less(3σ)

θ:±0.1° or less(3σ)

Wafer off-center limit

±5mm or less

(Wafer offset from chuck center)

Wafer holding method Backside vacuum chuck
Wafer hold check Vacuum sensor with digital display
Communication

RS-232C,RS-485(Serial Interface)

Photo I/O(Parallel interface)

Utility

Power:DC24V±10% 5A 1line

Vacuum:-80kPa or less.1line

Mass Main body:Appox.12kg

Contact us for questions about products.

product contact_1

  • contact smartphone notice
  • contact smartphone tel
  • contact smartphone fax
  • contact smartphone mail