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Semiconductor Fabrication Equipment
>
Thermal Temporally Bonding TWH Series
>
Debonder/Cleaner
De-bond Cleaner
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<プラットホーム>
タツモマルチレイアウト機構採用により、ユニット単体から、装置化まで多彩な形態をご提供。
<プロセスユニット>
機械剥離ユニット搭載
洗浄機構搭載
防爆、消防法等、各種安全仕様
<操作性>
GUI画面による優れた操作性を実現。複雑なレシピ編集も簡単に行えます。
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