MTQ-D

This transfer robot handles wafer sizes up to 300mm.

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Features

  • Accesses two FOUPs without trackes.
  • Mapping sensor availables as an optin.
  • The modular design of the R・T unit and elevation unit enables easy maintenanse, and also supports a long vertical stroke.
  • Prepared a new line up for 450mm wafer transfer with improved arm rigidity.

Specifications

Handling object

φ300mm  SEMI/JEIDA standard wafer.

(Please inquire with regard to special wafers such as glass wafers.)

Range of motion

R:480㎜(maximum arm reach,excluding end-effector)
T:350°(±175° from Home pos)

W:360°(±180° from Home pos)
Z:330㎜

P:185deg

Repeatability

XY:±0.1mm or less(3σ)
Z:±0.05mm or less(3σ)

P:±0.1deg or less(3σ)

Wafer holding method Selectable from options
Wafer hold check Vacuum sensor with digital display
Communication RS232C,RS-485
Utility

Power:1φ AC200V~AC230V 5.0A 1line

Dryair:0.5MPa 150L/min or more 1line

(φ6 × φ4 polyurethane tube one-touch fitting connected)

Mass

Main body:Appox.60kg

Controller(MCQ):Appox.18kg

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